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The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology.
Covering new developments in semiconductor design, thermal interface materials, cooling technologies, measurement and characterization.
Keynotes from Qualcomm, Cerebras Systems and Marvell Technology. Panels, exhibits and professional development.
Do you know an outstanding IMAPS member that deserves the distinction of an IMAPS Society Award?
Speak
Get in front of the advanced packaging industry by speaking at a conference, workshop or local event.
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Network
Engage with industry professionals, researchers and students to learn, share insights and develop contacts.
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Publish
Publish an article in our Advancing Microelectronics magazine or a technical paper in the Journal.
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Learn
IMAPS is committed to providing various formats of workforce development and education.
Learn MoreWho We Are
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IMAPS is the premier, non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government. IMAPS leads the advancement and growth of the advanced packaging workforce through professional education, upskilling, and networking across the entire semiconductor supply chain, both in-person via conferences and on-site training, as well as on-demand through the new IMAPS Academy software portal.
Featured
New Student Scholarship 2026
$10,000 Tuition Opportunity
Apply by May 31 ~ Enrolled in a graduate program related to microelectronics at a US university or institute? A winning candidate will be selected from a group recognized to be underrepresented in the field, with 2026 focusing on women.
3D InCites Media Platform
Now Powered by IMAPS!
The 3D InCites media platform now operates under the IMAPS umbrella, delivering a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors.
IMAPS Academy
Online Courses
On-demand semiconductor assembly and packaging courses taught by industry experts. Our latest courses are live presentation recordings ~ see previews of SiP System Solutions, 3D Packaging & Assembly, Understanding the Cost of FOWLP.
