Special Reports

Chiplet Fundamentals For Engineers: eBook

By: Bryon Moyer

A 65-page in-depth research report on the next phase of device scaling.
AI’s Impact On Engineering Jobs May Be Different Than Expected

By: Liz Allan

Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may be...
Liquid Cooling Gains Traction In Data Centers

By: Bryon Moyer

There are numerous ways to remove heat from chips, and more are on the way.

 more »

Top Stories

Securing Hardware For The Quantum Era

 Quantum computers may become a security threat as early as next year, and that threat w...
February 5th, 2026 By Ann Mutschler

Consumer, Med Tech Mushrooms As Quantum Closes In

 Bio-inspired medical devices can gather more data than ever before, and HPC/quantum wil...
February 5th, 2026 By Liz Allan

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems

 Existing technology is being upcycled and deployed in new ways as companies seek to mea...
February 5th, 2026 By Liz Allan

Why Move To 2nm?

 Leading-edge chipmakers are starting to look at process node scaling very differently.
February 4th, 2026 By Ed Sperling

Does Your RISC-V Core Meet The Standard?

 Verifying an extensible processor is more than a one-step process, especially when soft...
January 29th, 2026 By Brian Bailey

Multi-Die Assemblies Require More Detailed Test Plan Earlier

 Understanding connectivity issues and interactions are only part of the problem; ECOs c...
January 29th, 2026 By Ann Mutschler

Balancing Training, Quantization, And Hardware Integration In NPUs

 Evolving challenges and strategies in AI/ML model deployment and hardware optimization ...
January 26th, 2026 By Ann Mutschler

Every Atom Now Counts In Advanced Chip Manufacturing

 How atomic-layer deposition and hybrid dielectrics are redefining reliability and scali...
January 22nd, 2026 By Gregory Haley

An Explosion In Interconnect Complexity

 The chip industry has gone from two routing platforms to five. That's a lot.
January 22nd, 2026 By Bryon Moyer

Oxides Bring Low Leakage Transistors To Leading-Edge Memories

 New approaches and research surge in the face of DRAM shortages and SRAM scaling limita...
January 22nd, 2026 By Katherine Derbyshire

Addressing Critical Tradeoffs In NPU Design

 Flexibility, future-proofing, and performance considerations for neural processing units.
January 21st, 2026 By Ann Mutschler

Startup Funding: Q4 2025

 More and bigger funding rounds for AI chips and AI for making chips; 75 companies raise...
January 19th, 2026 By Jesse Allen

How And Why To Optimize NPUs

 PPA constraints need to be paired with real workloads, but they also need to be flexibl...
January 15th, 2026 By Ann Mutschler

Will 2026 Be Dominated By AI?

 Artificial intelligence has become central to almost all advances happening within semi...
January 15th, 2026 By Brian Bailey

Wafer Probe Struggles To Adapt To Multi-Die Assemblies

 Delicate features, uneven surfaces, and extreme density make it difficult to manage pro...
January 13th, 2026 By Gregory Haley

Secure Data Sharing Becoming Critical For Chip Manufacturing

 Driven by a plethora of benefits, data sharing is gradually becoming a “must have” ...
January 13th, 2026 By Laura Peters

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

 Process cost and yield issues delay the adoption of hybrid bonding.
January 13th, 2026 By Bryon Moyer

Is End-To-End Security Possible?

 New regulations make this non-negotiable, but multi-die assemblies and more interaction...
January 8th, 2026 By Ed Sperling

Automotive Outlook: 2026

 Tariffs, EV costs and challenges, and fundamental architectural and technology improvem...
January 8th, 2026 By Ann Mutschler

Security Threats Converge On IoT, Industrial ICs, Physical AI

 Edge devices across multiple applications share common attack vectors. Security functio...
January 8th, 2026 By Liz Allan

more top stories »

Latest News

Chip Industry Week in Review

 Intel's GPU push; strong M&A; Lam-CEA deal; AI workload fundings; Z-Angle memory; TSMC 3nm in Japan; improving chip power delivery; Arm's expanded startup program...
February 6th, 2026 By The SE Staff

Blog Review: Feb. 4

 3D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.
February 4th, 2026 By Jesse Allen

Chip Industry Week In Review

 New joint venture for high-speed interconnects; 2nm Indian chips; NAND capacity boost; quantum accelerates; CPO deals; U.S. rare earths deal; new AI chip; earning...
January 30th, 2026 By The SE Staff

more news »



Opinion

The Verification Conundrum

 When is verification finished, and how much effort was wasted ...
February 2nd, 2026 By Brian Bailey

Big Changes Ahead For Semiconductor Manufacturing

 Inside Chips Podcast: PDF Solutions' CEO discusses AI in chip ...
January 19th, 2026 By Ed Sperling

more opinions »



Research

Research Bits: Feb. 3

 Biodegradable electronics: Artificial synapse; microplastic pr...
By Jesse Allen

Chip Industry Technical Paper Roundup: Feb. 3

 AI-aided chip design; Cu-barrier properties of 2D WS2 films; s...
By Linda Christensen

Research Bits: Jan. 27

 Analog in-memory compute; quantum AFM sensor.
By Jesse Allen

more research »



Startup Corner

Startup Funding: Q4 2025

 More and bigger funding rounds for AI chips and AI for making ...
By Jesse Allen

Startup Tips To Get From Seed Funding To Series A, B, C

 Everyone has a bright idea about how to save power or boost pe...
By Liz Allan

more startups »

Videos

Changes In Chip Architectures At The Edge

February 4th, 2026

Agentic AI In Chip Manufacturing

January 28th, 2026

Software-Defined Systems

January 26th, 2026

Challenges In Moving Data In Chips

January 14th, 2026

Knowledge Centers / Entities, people and technologies explored

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