Next-Level Performance, Small Size, Robustness & Efficiency, Harnessing the Power of Solid-State, All-Silicon Piezo MEMS Technology
For personal audio & smart wearables
Deliver enhanced consumer audio experiences with unmatched clarity, detail, and spatial imaging.
For personal audio
Add active vent control to balance occlusion effects and active noise canceling (ANC) performance.
For mobile electronics
World’s first 1mm-thin all-silicon, solid state Active Micro Cooling Fan on a Chip for smartphones, tablets and other thin mobile electronics.
Eliminate thermal throttling, enhance clarity for AI voice interactions, and enable higher-performing, thinner and lighter devices with xMEMS PiezoMEMS components.
Improves performance for compact Edge AI devices and low-power data center subsystems.
Elevates AI voice clarity for smaller, thinner and lighter smart wearables.
Our solutions are key enablers in the evolving Physical AI ecosystem, addressing critical hardware challenges: thermal limits, compact form factors, and high-clarity voice interfaces.
Pioneering a New Era in Consumer Electronics with Piezo MEMS Innovations
xMEMS’ Piezo MEMS Silicon Solutions are based on the inverse piezoelectric effect created by applying an input voltage to make the piezo MEMS material contract or expand, converting electrical energy to mechanical energy. This energy excites an integrated silicon membrane to generate airflow and/or pressure.
