20 - 22 April 2026 - Brussels, Belgium
Connecting, Informing, and Inspiring the Global CS, PIC, PE and AP Industries
About AngelTech
Connecting, informing, and inspiring the global compound semiconductor, photonic integrated circuits, power electronics and advanced packaging industries. AngelTech will provide comprehensive coverage of all the key topics, issues and developments across these three sectors on 20 - 22 April at the Sheraton Airport Hotel in Brussels. Comprising of CS International, PIC International, Power Electronics (PE) and Advanced Packaging (AP) International. This single exhibition will bring together the leading players, from across the supply chains for two days of technical tracks and exhibit opportunities.
The 16th CS International builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations falling within 5 key themes: Growing Revenues in GaN Power Electronics, microLEDs: How to gain market traction, Revitalising the SiC industry, Advancing surface-emitting optoelectronics and Unlocking the potential of ultra-wide bandgap materials
The 11th PIC International builds on the strengths of the event’s previous editions, with around 40 leaders from industry and academia delivering presentations falling within four key themes: Foundations of PIC design: materials, devices and processes, Connectivity and scalability for secure, high-speed data networks, Emerging applications: photonics for sensing, imaging and beyond, Future computing: PICs for photonic processing, quantum computers, and neural networks
Attendees will discover the power electronics industry's thriving landscape at the 4th Power Electronics International Conference and Exhibition. With soaring sales of silicon devices and explosive growth in SiC and GaN technologies, the industry is filled with optimism. Attendees will enjoy two days of insightful talks and panel discussions, where we will delve into the factors driving this industry boom and address emerging challenges.
The 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation. Conference attendees will gain insights into the materials, methods, and technologies reshaping chip-level packaging and system integration. From cutting-edge thermal solutions to the reimagination of wirebond and leadframe formats, the event provides a comprehensive look at how packaging is enabling system-level innovation.
AngelTech Innovate Summit is the next generation of the successful Executive Strategy Summit! Designed as a more interactive and outcome-driven experience, this new event brings together senior leaders from the compound semiconductorm photonic integrated circuits, power electronics and advanced packaging industries, along with pioneering entrepreneurs, analysts and funding experts. The goal is simple: to collaboratively address the industry’s most pressing challenges and identify actionable paths forward.
Register
To register for AngelTech, please visit one of the event websites.
20 - 22 April 2026 Brussels, Belgium
Registration for AngelTech 2025 allows you access to all 4 international conferences (CS, PIC, PE and AP) on 20th and 22nd April 2026.
To register, please visit one of the event websites.
20 April 2026 Brussels, Belgium
The AngelTech Innovate Summit takes place the day before the main AngelTech conference and requires a seperate registration.
To register, visit the Innovate Summit Website.
2026 Speakers Include
2026 Sponsors Include
Contact Us
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