ASE

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Rooted in Experience Perfected in Execution

Smart Manufacturing by ASE

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Silicon Photonics

Join us in exploring the possibilities of silicon photonics and stay ahead in this rapidly evolving field!

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Robotic Sensing

Step into the Future: Discover the Evolution of Robotic Sensing!

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FOCoS-Bridge

ASE VIPack™ FOCoS-Bridge integrates multiple ASICs and silicon bridges to accelerate AI innovation.

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Technology Leadership

ASE is a primary architect of Heterogeneous Integration (HI)

Our technologies have enabled our customers to create cutting edge products that deliver superior performance, power, speed, and connectivity.

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System-in-Package

Silicon Photonics

MEMS and Sensor

Markets Enabled by ASE and Semiconductors

Applications fueled by Semiconductor Innovation

Sustainability Drives the Future

We are building a better world.

Social Influence

Sustainability Leadership

Press Center

Welcome to VIPack™

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

The Opportunities and Challenges of FOPLP Technology

ASE K18B Groundbreaking Ceremony: Strengthening Our Competitiveness in Advanced Packaging

Path to Net-Zero Emissions in IC Packaging

ASE Announces FOCoS-Bridge with TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

ASE Demonstrates CPO that Improves Energy Efficiency for AI applications

ASE Drives AI and Green Transformation for a Sustainable Future in Kaohsiung

Ainos and ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing

Innovation and Collaboration in Power Module Packaging: A Thermal Perspective

ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

Integrated Design Ecosystem™ for Chiplets and Heterogeneous Integration in Advanced Packaging Technology

Advanced Packaging Evolution: Chiplet and Silicon Photonics-CPO

ISE Labs Investment Secures the Establishment of New Site for Semiconductor Packaging and Test in Mexico

ASE “Guardians of the Sea” Wins Gold at the PwC Sustainability Impact Awards

ASE K28 Groundbreaking Ceremony: Strengthening Our Commitment to Innovation and Technological Leadership

ISE Labs Expands Capabilities, Doubles Lab Space with Opening of Second Silicon Valley Location

ASE introduces powerSiP™ for transformative power delivery that increases power efficiencies by 50% in AI and data center applications