AI architectures are approaching an inflection point, and that is why a new generation of scale-up architectures is needed. Enabling thousands of XPUs to operate as one massive chip for trillion-parameter AI models ….
Study: Merchant GPUs and Custom Accelerators to Reach $446B, HBM to Exceed $130B by 2029
August 12, 2025 by
According to a report by Dell’Oro Group, the global data center accelerator market is projected to reach $446 billion by 2029. Accelerators now account for roughly one-third of ….
Study: Merchant GPUs and Custom Accelerators to Reach $446B, HBM to Exceed $130B by 2029
August 12, 2025 by
REDWOOD CITY, Calif. – August 12, 2025 – According to a recently published report by Dell’Oro Group, the global data center accelerator market is projected to reach $446 billion by 2029. Accelerators now account for roughly one-third of total data center capex, making them the single largest driver of growth, the firm said. “The worldwide […]
JEDEC Collaborates to Release JESD270-4 HBM4 Standard for AI and HPC
April 21, 2025 by
ARLINGTON, Va., USA – April 16, 2025 – JEDEC Solid State Technology Association, developer of standards for the microelectronics industry, today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. Designed as an evolutionary step beyond the previous HBM3 standard, JESD270-4 HBM4 will further enhance data processing rates while maintaining essential features […]
SK hynix Announces CXL SDK Available on Linux
September 24, 2024 by
SEOUL, September 23, 2024 – SK hynix Inc. announced today that features of its Heterogeneous Memory Software Development Kit (HMSDK) software for optimizing Compute Express Link memory technology , are now available on Linux. SK hynix said HMSDK enhances the memory package’s bandwidth by over 30 percent without modifying existing applications by selectively allocating memory […]
SK hynix Partners with TSMC on HBM
April 19, 2024 by
Seoul, April 19, 2024 – Memory company SK hynix Inc. announced today a memorandum of understanding with TSMC to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced […]
SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue
April 3, 2024 by
Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, which the company said is the first of its kind in the U.S., will be an advanced….
AMD-Powered LUMI Supercomputer: In the Vanguard of HPC Performance and Energy Efficiency
May 22, 2023 by
[SPONSORED GUEST ARTICLE] LUMI is a model for both world-class supercomputing and sustainability. It also embodies Europe’s rise on the global HPC scene in recent years. The AMD-powered, HPE-built system, ranked no. 3 on the new TOP500 list of the world’s most powerful supercomputers, also ranks no. 7 on the GREEN500 list of the most […]
Recent Results Show HBM Can Make CPUs the Desired Platform for AI and HPC
November 4, 2022 by
Third-party performance benchmarks show CPUs with HBM2e memory now have sufficient memory bandwidth and computational capabilities to match GPU performance on many HPC and AI workloads. Recent Intel and third-party benchmarks now provide hard evidence that the upcoming Intel® Xeon® processors codenamed Sapphire Rapids with high bandwidth memory (fast, high bandwidth HBM2e memory) and Intel® Advanced Matrix Extensions can match the performance of GPUs for many AI and HPC workloads.
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
June 8, 2021 by
Hsinchu, Taiwan – June 8, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs. The main die of the platform contains the world’s first HBM3 Controller and PHY IP with […]
