GRENOBLE, France, Sept. 09, 2025 — Scintil Photonics today announced the completion of a $58 million (€50M) Series B funding round led by Yotta Capital Partners and NGP Capital, with participation from NVIDIA. The round includes new participation from BNP Paribas Développement, alongside existing investors including Supernova Invest, Bpifrance Digital Venture, Innovacom, Bosch Ventures, Applied […]
OpenLight Raises $34M for AI Data Center Photonics
SANTA CLARA, Calif., Aug. 26, 2025 — OpenLight, a Photonic Application-Specific Integrated Circuit (PASIC) chip design and manufacturing company, today announced the close of its oversubscribed $34M Series A. The round is co-led by Xora Innovation and Capricorn Investment Group. Other participants include Mayfield; Juniper Networks, now part of HPE; Lam Capital, the corporate venture […]
Photonic Computing: Lightmatter Reports 16-Wavelength Bidirectional Link on Single-Mode Optical Fiber
Photonic computing company Lightmatter today announced what it called groundbreaking new in optical communications: a 16-wavelength bidirectional Dense Wavelength Division ….
Charting the Photonic Future of AI Interconnect
The AI revolution has been fueled by a decade-long, million-fold increase in computational capability, driven by enhanced processor efficiency. However, interconnect bandwidth has not kept pace, leaving powerful ….
Sandia Labs Tests Laser-Based Photonic Data Center Cooling
Minnesota-based startup Maxwell Labs has entered into an R&D agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips. The company is working to develop the new technology to regulate the temperature of chips, while aiming to lower the power ….
Lightmatter Announces Passage L200, Co-Packaged Optics for AI
MOUNTAIN VIEW, Calif.– Photonic supercomputing company Lightmatter announced Passage L200, which the company said is the first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon designs, Passage L200 supports unprecedented AI performance scaling by eliminating interconnect bandwidth bottlenecks, the company said. The L200 3D CPO family includes both […]
DARPA Taps Cerebras and Ranovus for Military and Commercial Platform
AI compute company Cerebras Systems said it has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA) to develop a system combining their wafer scale technology with wafer scale co-packaged optics of Ottawa-based Ranovus to deliver ….
Q.ANT and IMS CHIPS Launch Pilot Production Line for Photonic AI Chips in Stuttgart
Q.ANT, a photonic AI chip company, said today it has launched a dedicated production line for its AI chips at the Institute of Microelectronics Stuttgart (IMS CHIPS).Capable of producing up to 1,000 wafers per year, the pilot line enables Q.ANT to refine its chip architecture to meet evolving market requirements. It also serves as the […]
Lightmatter and Amkor Technology Partner on 3D Photonics Package
MOUNTAIN VIEW, Calif., Nov. 14, 2024 — Photonic supercomputing company Lightmatter today announced a strategic partnership with Amkor Technology, Inc. (Nasdaq: AMKR), a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform. This collaboration harnesses Lightmatter’s groundbreaking 3D-stacked photonic engine along with Amkor’s advanced multi-die packaging expertise to […]
Oriole Networks Raises $22M for Photonics to Cut LLM Energy Use
London, 21st October: Oriole Networks – a company using light to train Large Language Models with low energy consumption – has raised an additional $22 million from investors to scale its “super-brain” solution. The round was led by Plural with all existing investors – UCL Technology Fund, XTX Ventures, Clean Growth Fund, and Dorilton Ventures – reinvesting. Oriole Networks addresses […]










