*cooling energy savings
Unlock Performance with JetCool's Liquid Cooling Solutions for NVIDIA H100 GPUs
NVIDIA H100 SmartPlate, designed for the NVIDIA Hopper H100 GPU series, is an advanced cold plate that unlocks unrivaled efficiency and performance. Built with our patented single-phase direct-to-chip liquid cooling technology, this best-in-class cold plate boasts an exceptionally low thermal resistance of 0.021C/W.
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Cooler Chipsets
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Power Savings
Unlock Performance with JetCool's Liquid Cooling Solutions for NVIDIA H100 GPUs
NVIDIA H100 SmartPlate, designed for the NVIDIA Hopper H100 GPU series, is an advanced cold plate that unlocks unrivaled efficiency and performance. Built with our patented single-phase direct-to-chip liquid cooling technology, this best-in-class cold plate boasts an exceptionally low thermal resistance of 0.021C/W.
Meet NVIDIA H100 SmartPlate
Maximize GPU Efficiency, Minimize Energy Cost with Precision Cooling
NVIDIA H100 SmartPlate facilitates full GPU utilization even under full workloads, without compromising on performance.
- Reduce overall AI cluster power consumption by 15%, enabling significant savings in large-scale deployments where energy costs can form a considerable part of operational expenses.
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models.
- Achieve 35°C cooler chips than air-cooled servers, outperforming air alternatives by 82%, critical for data centers where hardware reliability and uptime are paramount.
Tackle Demanding Artificial Intelligence and Machine Learning Workloads
Built with our patented single-phase direct-to-chip liquid cooling technology, this best-in-class cold plate technology supports leading AI servers ranging from the Dell XE9680 to the Dell PowerEdge R760xa. Featuring a low-profile and facility-ready design, this solution lowers power consumption while utilizing warm coolant temperatures up to 60°C for heat reuse and sustainability initiatives.
Maximize GPU Efficiency, Minimize Energy Cost with Precision Cooling
NVIDIA H100 SmartPlate facilitates full GPU utilization even under full workloads, without compromising on performance.
- Reduce overall AI cluster power consumption by 15%, enabling significant savings in large-scale deployments where energy costs can form a considerable part of operational expenses.
- Maximize GPU utilization with warm inlet temperatures up to 60°C, run at peak performance longer, accelerate computation-intensive processes and reduce time-to-solution for AI models.
- Achieve 35°C cooler chips than air-cooled servers, outperforming air alternatives by 82%, critical for data centers where hardware reliability and uptime are paramount.
Tackle Demanding Artificial Intelligence and Machine Learning Workloads
Built with our patented single-phase direct-to-chip liquid cooling technology, this best-in-class cold plate technology supports leading AI servers ranging from the Dell XE9680 to the Dell PowerEdge R760xa. Featuring a low-profile and facility-ready design, this solution lowers power consumption while utilizing warm coolant temperatures up to 60°C for heat reuse and sustainability initiatives.
Unleash Peak Performance with Liquid Cooling for NVIDIA H100 GPUs
Be at the forefront of innovation and efficiency with our NVIDIA H100 SmartPlate designed specifically for the NVIDIA H100 GPUs. Engineered to deliver peak performance and maximize compute density, it’s the ideal liquid cooling solution for the demands of AI workloads and high-performance computing.
Discover our Product Portfolio
We’ve designed and developed a variety of liquid cooling solutions to help enterprises in their transition to liquid cooling. From liquid cold plates to integrated die cooling, our product catalog supports a broad range of needs.
SmartPlate Cold Plate
SmartPlate Module is a fully-sealed cold plate that leverages our microconvective cooling® technology to provide unprecedented, energy-efficient cooling performance.
SmartLid
SmartLid targets processor hot spots directly with fluid-to-die to densify compute performance and tackle the industry’s most powerful devices.
SmartSilicon
Our in-silicon cooling solution embeds directly into the chip substrate to circulate coolant and target the die’s hotspots, increasing control over chip temperatures.
