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Wafer-Level Packaging Symposium

Addressing all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.

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Pan Pacific Strategic Electronics Symposium

Your ticket to research on advanced technology and world class networking!

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Virtual instructor-led training

Build strong SMT foundations with live, expert-led training. Courses run quarterly starting in January!

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Latest Technical Resources

Stencil Printing 201

Online Training

Stencil Printing 201

Take a deeper dive into the stencil printing process with this new course.

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Journal of SMT

Journal of SMT

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Includes the following peer-reviewed articles: The Intermediate Barrier Performance of Electroless Co-W-B / Ni-P Stacked Deposits Between Cu and Solder Joint; The Cleaning process simulation by Glass Test Boards; and Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints

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Watch Electronics Assembly Fundamentals Videos on Youtube

Videos

Jump Start Video Playlist

Watch these fundamental videos about electronics manufacturing on the SMTA Youtube channel.
Free for Everyone!

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SMTA International 2025 Proceedings

Conference Proceedings

SMTA International 2025

Includes over 80 papers on electronics manufacturing, additive manufacturing, advanced packaging, reliability and harsh environments research.

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Mission Statement:

SMTA is an international network of professionals dedicated to skill-building, sharing practical experience, and developing solutions across Electronics Manufacturing (EM). This includes expertise ranging from component manufacturing to system-level integration, encompassing microsystems, emerging technologies, and related business operations.

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1/1/2026 » 3/13/2026
SMTA LearnLive: Electronics Manufacturing Essentials (Course 1)

2/2/2026 » 2/5/2026
Pan Pacific Strategic Electronics Symposium (Pan Pac)

2/6/2026
Space Coast Chapter: Winter Golf Classic

2/6/2026
Dallas Chapter Technical Luncheon: Inside the Reflow Oven

2/10/2026
Houston Expo & Tech Forum

2/11/2026
Joint Boston Chapter/IEEE/iMAPS Technical Meeting: High Throughput Additive Manufacturing

Gold-Level Corporate Members

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