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The latest news, developments and announcements from around the electronics industry.

Silanna LiDAR laser firing ICs combine charging and firing

Silanna Semi SL2001 laser driver block diagram and application

Silanna Semiconductor is announcing its FirePower laser firing system ICs are now available in production quantities. They aim at LiDAR and rangefinder applications. Specifically, there is the SL2001 (above) and SL2002, and both have their own evaluation kits (SL2001 EVK, SL2002 EVK). The company highlights they combine resonant capacitor charging and high-current laser diode firing on a single device. This ...

Spectrum analyser delivers high-frequency up to 44 GHz

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The R&S FPL1044 spectrum analyser sees Rohde & Schwarz expanding its portfolio of mid-range instruments. There’s also a new 40 MHz real-time spectrum analysis (RTSA) option for its entire FPL family. The new model offers a DC coupling option, expanding the measurable frequency range to start from 10 Hz. Applications include testing satellite and radar systems and components. Also, the ...

Elon to launch datacentre satellites from the Moon

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Elon Musk has told his staff at xAI – his AI development company – that they need to build a factory on the moon to build datacentres to be launched from the moon by a catapult, reports the New York Times. This will give xAI more computing power than its AI rivals. “If you’re moving faster than anyone else in ...

Sharp increase in VC-backed AI company exits

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AI and ML startups accounted for more than a third of all of the combined value of VC-backed exits last year, says a report from  BestBrokers. The data can be accessed on Google Drive via this link. Venture capital exit value reached $549.2 billion in  2025, with AI startups generating $189.6 billion of that total, or 34.5% of all exits, ...

Toshiba expands eFuse lineup

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Toshiba has expanded its electronic fuse (eFuse) lineup with the introduction of the 40V TCKE6 series. The five new products are the TCKE601RA, TCKE601RL, TCKE602RM, TCKE603RA, and TCKE603RL. The eFuse ICs are suitable for use in industrial equipment, such as robots and programmable logic controllers (PLCs), as well as consumer equipment, including robotic vacuum cleaners and copy machines. The TCKE6 ...

Active smartphone installed base grew 2% in 2025

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The installed base of active smartphones grew 2% in 2025, according to Counterpoint Research. “Each of the eight leading smartphone OEMs had an active installed base exceeding 200 million devices in 2025, together accounting for over 80% of the global active installed base,” says Counterpoint’s Tarun Pathak, “only Apple and Samsung have surpassed the one-billion active devices milestone.” The premium ...

DCPI market to top $80bn in 2030

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The Data Centre Physical Infrastructure (DCPI) market is projected to grow at a mid-teens CAGR from 2025 to 2030 to reach more than $80 billion, says Dell’Oro. While demand signals remain exceptionally strong, power scarcity has become an increasingly binding constraint on near-term expansion, with on-site generation evolving from a contingency option to a practical necessity for large AI campuses. ...

HighTec Rust and C/C++ Arm dev platform adds LLVM 19 support

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HighTec EDV-Systeme, the automotive MCU compiler specialist, has released a new version of its HighTec Rust and C/C++ Arm Development Platform. Version v10.0 broadens its device support, integrates LLVM 19 (the Low Level Virtual Machine open source compiler), and supports memory-safe Rust for hybrid development with legacy C/C++. HighTec HighTec also highlights v10.0 comes with qualification kits to help speed ...

Behaviour prediction startup raises $100m

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Simile, a startup which predicts human behaviour, has raised $100 million. It aims, for instance, to predict a person’s purchasing decisions, what questions an analyst might ask on an earnings call or what the reaction will be to a corporate announcement or a product launch. Investors were Index Ventures, Bain Capital Ventures, A*, Hanabi Capital,  Fei-Fei Li and Andrej Karpathy. ...

ZAM challenge to HBM

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Prototypes of Z-Angle Memory (ZAM) are slated for 2027, says Intel, with mass production scheduled for 2030. ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of  a jv between Softbank, Tokyo University and Intel called Saimemory which was later joined by Fujitsu. The initial technology came ...