SisuSemi: From particle clean to atomic precision
Our
Solutions
The problem
Semiconductors power the modern world, driving innovations in computing, communications, healthcare, and renewable energy. As device dimensions shrink and performance requirements skyrocket, the industry is increasingly battling one of its most formidable adversaries: atomic-level contaminants and defects at semiconductor surfaces interfaces.
What we offer
As device architectures continue to shrink, with nodes moving to 3 nm and below, traditional cleaning methods are no longer sufficient. SisuSemi addresses these challenges, ensuring that every surface within a semiconductor wafer is free from contaminants that could compromise functionality.
key Features and benefits
By cleaning and ordering semiconductor surface at atomic-level, SisuSemi reduces defect density by an astonishing 3-4x and cuts leakage current up to 70%. The result? Dramatic improvements in chip performance, with a 50% boost in battery life and up to a 20% increase in manufacturing yield.
Integrations
The SisuSemi solution seamlessly integrates into production lines. Whether you’re looking to upgrade an existing production line or planning a greenfield implementation, SisuSemi is designed for seamless integration. Our solution can be easily incorporated into your current manufacturing processes without major disruptions
Schedule a Feasibility testing?
In feasibility testing the improvement potential with your semiconductors is discovered. First, we agree on testing arrangements and KPIs, and then treat your component samples in SisuSemi laboratory. Based on that the results are analyzed and the improvement potential defined.
Sisusemi
The roots of the SisuSemi technology are in the University of Turku, Finland, with materials research focus on advanced materials, nanotechnology, and sustainable energy materials. First patents protecting the SisuSemi technology are from 2015.
SisuSemi
