This is the repository for PCB schematics and 3D printed molds used in the "MagnetIO: Passive yet Interactive Soft Haptic Patches Anywhere" paper (ACM CHI2021).

• silicone (Smooth-On Dragonskin FX Pro)
• silicone adhesive (Smooth-On SilPoxy)
• magnetic powder (NdFeB)
• ferrous powder (carbonyl iron)
• copper enameled wire (28 AWG)

When using or building upon this device in an academic publication, please consider citing as follows:

Alex Mazursky, Shan-Yuan Teng, Romain Nith, and Pedro Lopes. 2021. MagnetIO: Passive yet Interactive Soft Haptic Patches Anywhere. Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems. Association for Computing Machinery, New York, NY, USA, Article 213, 1–15. DOI:https://doi.org/10.1145/3411764.3445543