John Martinis is a distinguished physicist and 2025 Nobel Laureate in Physics, renowned for his pioneering contributions to superconducting quantum computing. His research has been central to developing high-fidelity qubits and engineering the architectures needed for scalable quantum processors. He previously led Google’s quantum hardware team, where his group achieved the landmark 2019 quantum supremacy experiment — the first demonstration of a quantum computer outperforming the world’s most powerful classical supercomputer on a computational task. In 2022, he co-founded Qolab, where he now serves as CTO and continues to advance next-generation superconducting qubit technology and quantum system design.

Dr. Baaziz Achour serves as Executive Vice President and Chief Technology Officer of Qualcomm Technologies, Inc. In this role he is responsible for global research and development activities associated with all technologies in QCT, Qualcomm’s semiconductor business, as well as overseeing the execution of enterprise-wide technical and product roadmaps across all business areas.

Dr. Achour first joined Qualcomm as a Systems Engineer in 1993. Over the course of his tenure with Qualcomm, he has held several leadership roles within the engineering organization and has helped drive the expansion of Qualcomm’s leadership in critical technology areas as the company has diversified. Dr. Achour has been essential in contributing to nearly every generation of technology and was a key part of the leadership team that enabled the accelerated launch of 5G.

Dr. Achour holds a B.S. degree in Physics from the University of Algiers, and master’s and doctorate degrees in Electrical Engineering from Tufts University. He has twenty-four granted U.S. patents in the area of communications.

Jan Rabaey is Professor Emeritus in the EECS Department the University of California at Berkeley, after being the holder of the Donald O. Pederson Distinguished Professorship at the same institute for over 30 years. He is a founding director of the Berkeley Wireless Research Center (BWRC), the Berkeley Ubiquitous SwarmLab, and the SIA-DARPA GSRC Center. He served as the Electrical Engineering Division Chair at Berkeley twice. From 2019 until 2025, he also served as the CTO of the System-Technology Co-Optimization (STCO) Division of IMEC, Belgium.

Prof. Rabaey has made high-impact contributions to a number of fields, including low power integrated circuits, advanced wireless systems, mobile devices, sensor networks, and ubiquitous computing.  Some of the systems he helped envision include the infoPad (a forerunner of the iPad), PicoNets and PicoRadios, the Swarm, Brain-Machine interfaces and the Human Intranet. 

He is the primary author of the influential “Digital Integrated Circuits: A Design Perspective” textbook that has served to educate hundreds of thousands of students all over the world. He is the recipient of numerous awards, amongst others the 2009 EDAA Lifetime Achievement Award. Most recently, he received the 2025 IEEE James H. Mulligan Jr Education Medal,  the 2025 IEEE CASS John Choma Education Award, and the IEEE 2026 Donald O. Pederson Solid State Circuits Award. He is a Life Fellow of the IEEE, and has been involved in a broad variety of start-up ventures.

Dr. Timothy Costa is ​the General Manager (GM) for Industrial and Computational Engineering at NVIDIA, where he spearheads the strategic development and implementation of solutions for these critical industries.

Tim holds a Doctor of Philosophy (Ph.D.) in Mathematics, focusing on numerical methods for modeling fluids and semiconductors.

At NVIDIA, Tim has held several leadership positions. Currently, he leads the Semiconductor, Industrial Engineering and Quantum verticals, as well as the CUDA-X product line. Previously, he was Director of HPC Software and Quantum, where he built the NVIDIA Quantum platform, managed the CUDA libraries product line, and launched the NVIDIA HPC SDK. He has played a key role in shaping NVIDIA's scientific computing offerings and driving innovation in the Quantum Computing industry.

As General Manager (GM), Industrial and Computational Engineering, Tim's focuses on leveraging NVIDIA's accelerated computing technology and AI solutions to address the complex challenges faced by industrial and semiconductor customers.

Lalitha Immaneni is a Vice President of Semiconductor Research & Development in the Assembly Test Technology Development organization for Intel Corporation. Lalitha manages a world class and diverse team of packaging architects, designers, and specialized engineers in the “Advanced Design & Customer Enabling” group, spanning multiple geographies (USA, Malaysia, and India).  She leads the Back end technical interface to Intel’s foundry customers.

Lalitha is responsible for developing substrate/silicon, assembly, and board design rules, designing essential building blocks for emerging packaging technologies, developing electrical and physical design methodologies for packaging as well as delivering product package architectures, supporting product electrical analysis, and executing product designs for Intel Foundry.   She is also responsible for the thermal, mechanical, and electrical analysis of Intel’s packaging choices and the implications across the product envelopes while also delivering industry leading power delivery and HSIO solutions.

Lalitha owns the vision and execution of a centralized package and board flows/tools as well as enabling the EDA ecosystem readiness for Intel’s packaging and board design needs.

Lalitha is a global leader and role model with a 30-year track record of stellar technical achievement in the semiconductor packaging industry.  Her technical accomplishments include leading Intel through multiple transitions in the package design tools towards better efficiency and quality. Widely recognized within the packaging EDA partner community, Lalitha is known for driving design tool capabilities for die disaggregation.  She has led many “firsts,” including enabling the definition of the first industry EDA packaging tool and leading package co-design for the first Foveros and EMIB products. She recently led the Package Assembly Design Kit delivery for Intel foundry Services and is currently focused on EDA ecosystem enablement, interoperable formats, and standards for chiplets.

Lalitha volunteers extensively as a coach and mentor for Positive Paths, a non-profit organization serving women in Phoenix.   She is a co-chair for the Intel Network of Executive Women (iNEW). She is a renowned mentor and coach to countless engineers within and outside Intel

Huiming Bu is vice president of IBM Global Semiconductors R&D and Albany Operation. He has 20+ years of professional experience in semiconductor technology R&D at IBM after he received his Ph.D. in Electrical Engineering from Yale University. Huiming started his technical career at IBM on High-κ/Metal Gate project and then led SOI FinFET research for IBM’s 14nm node technology. After that, Huiming and his team delivered 10nm/7nm technology nodes and are now focusing on 2nm/1.4nm development. Huiming also leads Pathfinding R&D to enable the path to 7A technology and beyond for IBM and its Joint Development Alliance (JDA) partners. In his current role, Huiming is responsible for global IBM Semiconductors R&D strategy across world-wide labs. He oversees R&D activities in advanced logic, chiplet and advanced packaging, emerging memory and analog AI hardware. In addition to driving semiconductor technology R&D agenda, Huiming is also responsible for IBM Research Albany site and fab operations. Huiming has authored/co-authored 100+ technical publications and holds 100+ patents in semiconductor area.

Artour Levin is a seasoned technology leader and expert in semiconductor design and engineering with over 30 years of industry experience. He currently serves as Corporate Vice President of AI Silicon Engineering at Microsoft Corporation, where he leads the company’s in-house team focused on defining and building advanced silicon AI acceleration technologies — custom hardware designed to power next-generation artificial intelligence workloads.

Before joining Microsoft, Artour spent a significant portion of his career at Intel. There, he held wide range of leadership positions in developing Products and IPs across various markets including Client, Data Center, Graphics and Accelerating Computing This long tenure gave him broad expertise in chip design, development processes, and silicon innovation. 

Artour's background combines deep technical knowledge in semiconductor design, system-level architecture, and AI hardware acceleration. His work focuses on creating efficient, high-performance silicon solutions at a time when AI and machine learning are reshaping demands on computing hardware.

Amit Gupta is Senior Vice President and General Manager of the Solido Custom IC and Central AI divisions at Siemens EDA. He leads the strategic growth and development of Solido's AI-powered solutions for variation-aware custom IC design, simulation, library characterization, and IP validation, as well as the Fuse EDA AI system.

In 2005, Gupta founded Solido Design Automation and served as President and CEO. The company became the leading supplier of AI-based software, helping top semiconductor companies reduce electronic chip failures due to manufacturing variation, while improving performance and profitability. Siemens acquired Solido in 2017.

Gupta has served on the boards of Solido, Analog Design, Clevor Technologies, and Electronic System Design Alliance. He is Executive in Residence at the University of Saskatchewan.

Gupta graduated with degrees in both Electrical Engineering and Computer Science with Great Distinction from the University of Saskatchewan. He was awarded the best engineering design project award, and outstanding alumni award for significant accomplishments since graduation.

William Wang is the CEO and Founder of ChipAgents.ai, the category leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded the UCSB Center for Responsible Machine Learning, the Mind and Machine Intelligence Initiative, and the UCSB NLP Group. His honors include the IEEE SPS Pierre-Simon Laplace Award, NSF CAREER Award, BCS Karen Sparck Jones Award, DARPA Young Faculty Award, and IEEE AI’s 10 to Watch.