GlobalFoundries

As AI accelerates, bandwidth demand is outpacing what electrical interconnects can deliver. That’s why silicon photonics is the essential architecture in data centers. GF's platform is ready for what comes next. We offer an end-to-end silicon photonics and SiGe platform designed to deliver the scale and efficiency today's optical interconnects require. Our platform also uniquely enables co-integration, giving customers a streamlined path from optics to electronics and reducing system complexity in the process. Read the full blog to learn how GF is advancing the roadmap to 400G/λ and beyond. Link in the comments. #SiliconPhotonics #Semiconductors #AI

AI workloads are doubling data center power consumption. They're also exposing the limits of the hardware that's been running these systems for years. Here's a look at the infrastructure problem at the center of the AI buildout. You can watch our recent IR webinar for a breakdown of why the shift is happening and how GF has positioned itself as a market leader in silicon photonics. We look forward to continuing the conversation at our Investor Day on May 7th in New York City. #Semiconductors #SiliconPhotonics #OpticalNetworking #DataCenters

The conversation around quantum computing is shifting from whether it will work, to how it will be built at scale. At GF, our answer starts with manufacturing. No single qubit architecture has emerged as the clear path forward, so we build platforms that serve all of them, from silicon photonics to FDX and RF to heterogeneous integration. On this #QuantumDay, read our new blog post to learn what it takes to bring quantum from the lab to volume production. Link in comments. #Semiconductors #EssentialChips #QuantumComputing

We’re reflecting on some of the conversations from #OFC2025. One of the main takeaways was the important role of silicon photonics in enabling AI infrastructure, data center interconnects and next-generation optical networks. GF has been investing in silicon photonics R&D for more than a decade. In this short video, Ted Letavic shares his thoughts on what essential innovation requires: the right team, the patience to invest before the market catches up and the willingness to build toward something the industry is still preparing for. #SiliconPhotonics #EssentialChips #Semiconductors

AI infrastructure is changing at the network level. Mike Hogan breaks down why lateral machine-to-machine communication now dominates network load and what that means for interconnect efficiency. For a deeper look at the next era of power efficiency, watch our recent webinar on silicon photonics at the link in the comments. #Semiconductors #SiliconPhotonics #PowerEfficiency

GF is proud to be recognized by Apple as a core, long‑standing partner in its American Manufacturing Program. Apple is bringing new advanced silicon process technology to our Malta, New York fab—available in the United States for the first time—and together with Cirrus Logic we’re delivering the mixed‑signal chips behind key Apple features like Face ID.   This matters because it strengthens U.S. semiconductor manufacturing at a moment of rising demand for secure, reliable and domestically produced chips. It reflects how GF’s U.S. operations, technology capabilities and global teams are helping turn Apple’s long‑term U.S. commitment into real manufacturing capacity, real technology progress and real supply‑chain resilience.   Learn more 👉https://lnkd.in/eHPrvEFy

This week, Mike Hogan, our Chief Business Officer, joined the 2026 New York State Nanotechnology Network (NNN) Symposium at Syracuse University to share a keynote on Physical AI and the next era of intelligent systems. As AI moves beyond the screen and into the physical world, it is redefining what systems must do: sense, think, act and communicate with high efficiency, security and reliability. That shift expands the semiconductor opportunity across sensing, connectivity, power and integrated intelligence, not just compute. Through GF Labs and our university engagement, we are focused on:  - Partnering with academia to accelerate feature-driven innovation  - Advancing energy efficiency across edge and data center needs  - Strengthening regional ecosystems that support a secure, resilient supply chain Thank you to the students, faculty, industry leaders and government partners who made the day valuable, including the conversations during the poster session and career fair. #PhysicalAI #EssentialInnovation #GFLabs #WorkforceDevelopment #Nanotechnology #NNNSymposium 

Today, we marked an important milestone in our global manufacturing journey as we officially broke ground on the SPRINT expansion at our Dresden, Germany site. This investment strengthens Europe’s largest semiconductor manufacturer and reinforces our commitment to delivering the essential chips the world relies on. As Europe’s largest foundry, this €1.1 billion investment is a strategic move that extends beyond just physical expansion by: 🏭 Boosting annual capacity to well over 1 million 300mm wafers by 2028 🤖 Delivering innovation in AI, Power Efficiency and Quantum Computing 🌐 Strengthening our global manufacturing footprint across the US, Asia and Europe This next phase of growth reflects our continued partnership with customers and our global team’s focus on delivering essential technology where our customers need it.

We're excited to be in L.A. this week for an action-packed OFC Conference, where we’ll be showcasing our latest #SiliconPhotonics and #SiliconGermanium technologies and advancements for optical networking! Visit us at booth 817 to speak with technical experts from our SiPh and SiGe teams or visit one of our partner booths around the show floor to see our technology in action. And don't miss the IEEE Photonics Society and Global Semiconductor Alliance panel on Wednesday for a collaborative discussion from industry leaders driving innovation in SiPh, co-packaged optics and advanced packaging. #OFC2026 #Photonics #OpticalCommunications

As AI workloads surge and cloud infrastructure scales, the demand for faster, more energy‑efficient data movement has never been greater. At GF, we’re meeting this challenge head‑on with breakthrough innovations in high‑performance silicon photonics and silicon germanium technologies. Our latest advancements are helping overcome the bottlenecks of traditional electrical interconnects—unlocking: 🔸 200G/λ PAM4 support, enabling scalable 1.6T transceivers 🔸 Multiple high‑speed modulator options including Mach‑Zehnder, MicroRing & RAMZI 🔸 High‑performance photodetectors for advanced receiver architectures 🔸 SiN waveguide integration for higher optical power, improved coupling & reliability 🔸 TSV‑based 2.5D/3D integration, powering next‑gen co‑packaged optics These innovations are shaping the next era of optical connectivity—delivering the reach, bandwidth density, and energy efficiency our customers need as they scale for the future. 🔗 Read the latest blog from Radhika Arora, Kyra Ledbetter and Arvind Narayanan to dive deeper into how GF is accelerating the roadmap for high‑performance optical interconnects: https://bit.ly/4rxgUWB #SiliconPhotonics #SiGe #CPO