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Optimizing Satellite Communication Links
Low Earth Orbit (LEO) satellite communications networks are redefining the concept of anytime, anywhere internet connectivity, offering high speed broadband access services for consumer, enterprise, and government agencies. With the advent of new direct-to-device (D2D) services, LEO-based services are poised to further expand coverage, utilizing existing cellular based mobile device technologies.
Today’s LEO platforms utilize millimeter-wave frequencies such as Ka-, E-, Q-, V- and W-Bands for uplinks and downlinks, inter-satellite links (ISLs) and telemetry, tracking and command (TT&C) channels, requiring higher power efficiency, linearity, and signal gain for optimal performance.
MACOM provides a broad portfolio of high-performance optical, RF, microwave and millimeter-wave semiconductor solutions to help customers maximize data throughput, spectral efficiency, reliability, power consumption and overall link budget. MACOM’s portfolio includes Free Space Optics, RF over Fiber, SSPAs and linearization solutions along with a full complement of semiconductor solutions including power amplifiers, low noise amplifiers, switches and control products. MACOM technologies are engineered to maximize RF efficiency, reduce system size, weight and power (SWaP), and enable reliable operation in demanding space and ground-based communications platforms. As LEO networks continue to scale, MACOM is helping power the next generation of global connectivity.

Enabling the Future of 3.2T Connectivity
As AI infrastructure continues to scale, the path to 3.2T connectivity is driving a new generation of optical and electrical interconnect technologies. Supporting these unprecedented data rates requires more than incremental improvements. It demands solutions that deliver exceptional bandwidth, signal integrity, power efficiency and reliability across the data center. MACOM’s broad portfolio of high performance connectivity solutions spans lasers, drivers, TIAs, photodiodes and advanced analog semiconductor technologies that power next-generation optical modules and systems.
Building on these technologies and decades of expertise in high speed connectivity, MACOM now offers a front end chipset solution for 3.2T optical modules, combining transmit and receive technologies optimized for 448 Gbps PAM-4 optical links. Engineered to address the demanding requirements of AI and cloud infrastructure, the chipset, consisting of the MATA-42754 and MATA-41754 quad linear TIAs, MARP-BRP224 backside-illuminate PIN Photodiode as well as the MAOM-025408 and MAOM-022404 driver solutions, enables scalable, high-bandwidth optical links while helping customers simplify design complexity. In addition, by providing key optical building blocks from a single supplier, MACOM helps customers accelerate development, simplify qualification and optimize link performance for next-generation AI networks.
Discover how MACOM is enabling the next wave of AI-driven connectivity. Read our latest press release to learn more about the new 3.2T chipset and the advanced optical solutions powering the future of data centers.

Coherent Metro, Unleashed.
Smaller. Faster. Smarter.
MACOM is powering the next wave of campus, metro and long-haul optical networks with a robust portfolio of high-performance components designed for coherent transmission.
From high-speed dual and quad channel linear transimpedance amplifiers (TIAs) to quad-channel drivers, our solutions are engineered to meet the demands of high density, high efficiency coherent interconnect and transport deployments. Whether you're building 400G, 800G or 1.6T single and multi-wavelength systems, MACOM delivers the performance and scalability to keep your network ahead of the curve.
What's Inside our Portfolio?
- Ultra-efficient and low noise linear TIAs for 400G to 1.6T coherent receivers
- High-output modulator drivers for single-ended and differential systems featuring Silicon Phonics, Indium Phosphide and Thin Film Lithium Niobate modulators
- Compact standard QSFP, OSFP, CFP2 or custom coherent modules for cost-effective campus, metro and long-haul scaling
Why MACOM?
Because we don’t just support coherent metro and long haul —we help define it. With decades of RF and optical innovation, MACOM is your trusted partner for building the networks of tomorrow.
MACOM Product Center
Pushing the limits for higher power, higher Frequency, higher levels of integration and higher data rates!
Every year we release to production over 150 new standard products and many more custom products! Check back frequently to stay up to date on our IC design and semiconductor process technology updates.
Our product qualification and release process is robust and demanding to ensure the 1st and the 1 millionth product we deliver meets and exceeds our customers' expectations.
RF/Microwave & mmWave
Optical
Networking
Supporting A Secure and More Connected World

We apply advanced circuit designs techniques, packaging solutions and semiconductor materials to the most demanding applications. Solutions from single IC to complex subassemblies manufactured with the tightest quality control.
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Our deep knowledge of high-speed signal processing, analog & mixed signal and digital design and optical semiconductors enables our customers to achieve the fastest possible connections inside and around the Data Center, whether NRZ, PAM-4, or Coherent.

Our ICs address a broad range of markets including 5G wireless communications, microwave radio links, satellite ground stations and broadcast video.

How Can We Help You?
Our customer application teams have decades of experience and are ready to support you today! We recognize our customers are under technical, schedule and cost pressures to execute and we are here to help. We can provide product application support, make recommendations on what IC may work the best in your application, help with your PCB design, all of which we hope saves you time to finish your design. Let us help you accelerate your time to market!
Submit your engineering, technical, general and application specific questions to our Support Team today.
Our technical staff in North America, Europe and Asia are ready to connect face to face, or virtually. Don’t hesitate to reach out!