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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

June 5, 2026 | Marcy LaRont, I-Connect007
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It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4

June 4, 2026 | Anaya Vardya, American Standard Circuits
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Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?




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