Trends in the Chip Packaging and Testing Industry (Part II)

Trends in the Chip Packaging and Testing Industry (Part II)

Industry Status and Investment Opportunities The packaging of AI chips primarily utilizes advanced packaging technologies. For instance, NVIDIA’s GPUs consume a significant portion of TSMC’s Cowos, which is a 2.5D packaging technology. In mainland China, publicly listed packaging and testing companies generally face the issue of being large but not strong. To seize opportunities, we … Read more

Lesson 7: STM32F4 + Proteus + Independent Watchdog (IWDG)

Lesson 7: STM32F4 + Proteus + Independent Watchdog (IWDG)

1Introduction to the Independent Watchdog The watchdog is a hardware timer whose main function is to forcibly reset the entire system when a software fault or program runaway occurs, allowing it to return to normal operation. It is an independent system that can continue to operate even if the main clock fails, thus ensuring high … Read more

Configuration and Testing of Touch Screen on M300

Configuration and Testing of Touch Screen on M300

The M300 SDK supports a wide range of touch screens. Due to the limited number of users utilizing screens, the documentation on how to configure the screen on the M300 is somewhat vague. This article introduces how to configure the touch screen in the SDK and the testing process.Note: This article uses SDK v7 for … Read more

Goodbye Serial Testing! Siemens Tessent IJTAG Pro Breaks the 3D IC Testing Dilemma

Goodbye Serial Testing! Siemens Tessent IJTAG Pro Breaks the 3D IC Testing Dilemma

Abstract “A 3D chip the size of a fingernail contains hundreds of billions of transistors, but the number of ‘pins’ to test it may be fewer than that of an old SIM card!” This statement left a deep impression on me during a recent conversation with semiconductor engineers. As chip design transitions from 2D to … Read more