UCIe

Future Development Trends in the Chip Packaging Industry

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Future Development Trends in the Chip Packaging Industry

The chip packaging industry is at a crossroads in the “post-Moore’s Law era.” Based on the latest information from multiple authoritative organizations and industry leaders for 2024-2025, the future development trends over the next 5-7 years can be summarized with “six key terms + three roadmaps.” Keyword 1: System-Level Ultra-Large Packaging (SLP/CoPoS) • In 2025, … Read more

Alphawave’s First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

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Alphawave's First UCIe IP Subsystem Based on TSMC 2nm Successfully Taped Out

On June 5, semiconductor IP company Alphawave Semi announced that its UCIe IP subsystem has successfully taped out, utilizing TSMC’s 2nm (N2) process, supporting a 36G Die-to-Die data rate. This IP is fully integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology, unlocking breakthrough bandwidth density and scalability for next-generation chiplet architectures. This milestone builds on … Read more