Capabilities
 | Parameters |
|---|---|
| Material | FR4 (140Tg, 170Tg, 180Tg), Halogen-free, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, Mix-Lamination, etc |
| Material Brands | KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or other laminate on customer's request |
| Layer Count | 1~40 |
| Flammaility | UL 94V-0 |
| Thermal Conductivity | 0.3W-400W/mk |
| Quality Standards | IPC Classes 2/3 |
| HDI Build-up | Any Layer, up to 4+N+4 |
| Board Dimension | 1-2 Layers: 1500mmx600mm Multilayer: 620mmx720mm |
| Board Thickness | 0.037mm-6.5mm |
| Min Thickness | 2-layer: 0.1mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
| Copper Thickness | 1/3~33oz |
| Solder Mask Colors | White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black |
| Solder Mask Brands | Green: RongDa, KuangShun White: Coants, LanBang, Taiyo |
| Solder Mask Thickness | 0.2mil-1.6mil |
| Solder Mask Dam | 50μm |
| Surface Finishes | Bare Copper, Hasl lead-free, Carbon Ink, ENIG, Gold Fingers, OSP, IAg, ISn, etc |
| Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
| Min Hole Size | Laser: 0.08mm Mechanical: 0.15mm |
| Min Trace Width/Spacing | 64μm/64μm |
| Minimum Solder Mask Clearance | 2mil |
| Min Annular Ring | 50μm |
| Min Pad to Pad Clearance | 40μm |
| Via Plugging | 0.2~0.8mm |
| Line Width/Space Tolerance | ±0.015mm |
| Board Thickness Tolerance | ±5% |
| Hole Diameter Tolerance | ±0.05mm |
| Hole Location Tolerance | ±2mil |
| Layer to Layer Registration | ≤100μm |
| S/M Registration | ≤38μm |
| Aspect Ratio | Standard: 25:1 Max.: 35:1 |
| Blind Vias Aspect Ratio | 0.8:1 |
| Outline Tolerance | ±0.1mm |
| V- CUT Tolerance | ±10mi |
| Bevel Edge | ± 5mil |
| Impedance & Tolerance | 50Ω；±10% |
| Warp and Twist | ≤0.50% (max cap) |
| Quality Test | AOI, 100% E-test |
| Value-Added Services | DFM Check, Expedited Production (24Hrs) |
| Featured Processes | Z-axis Milling, Thick Copper, Copper Block Embedded, High-Frequency Foam Board, High-Frequency Mix-Lamination, Blind/Buried Via, Press-Fit Hole, Castellated Holes, Step Staggered, Resin Plugged Hole, Countersink/Counterbore Hole, Via in Pad, Edge-Plating, Impedance Control, Carbon Ink, Peelable Solder Mask, Gold Finger |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
| Capabilities | Daily 3750 Sqm Monthly 110,000 Sqm |
| Number of layers | S<1m² | 1≤S<5m² | 5≤S<20m² | 20≤S<50m² | 50≤S<100m² | 100m²以上 | Expedited (≤3㎡) |
|---|---|---|---|---|---|---|---|
| 2L | 4 | 5-7 | 5-7 | 6-9 | 8-10 | 9-12 | 12~24 hours |
| 4L | 5 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 1~4 working days |
| 6L | 6 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 2~4 working days |
| 8L | 7 | 6-8 | 6-8 | 8-10 | 10-12 | 10-15 | 4~6 working days |
| 10L | 9 | 9-11 | 9-11 | 10-12 | 12-14 | 13-17 | 5~9 working days |
| 12L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 14L | 10 | 10-12 | 10-12 | 11-13 | 13-15 | 14-18 | 7~14 working days |
| 16L | 11 | 13 | 13 | 15 | 16 | 17 | Contingent |
| 18L | 12 | 14 | 14 | 16 | 17 | 18 | Contingent |
| 20L | 13 | 14 | 14 | 16 | 18 | 19 | Contingent |
| 22L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 24L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 26L | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| 28L+ | 15 | 15 | 15 | 18 | 20 | 22 | Contingent |
| China Mainland Base | Malaysia Base | Mexico Base |
|---|---|---|---|
| Turnkey Service | Design + PCB FAB + Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly + Product Assembly | Components Sourcing + PCB Assembly |
| Assembly Technologies | THT, SMT, Hybrid Mount, Subsystem Assembly | THT, SMT, Hybrid Mount, Semi Assembly | THT, SMT, Hybrid Mount, Subsystem Assembly |
| Manufacturing Abilities | Prototyping, Low to High Volume | Prototyping, Low/Medium/High Volume | Prototyping, Low to Medium Volume |
| Component Abilities | Chips 0201mm BGA, QFP & CSP 0.25mm BGA repair and reball | Chips 0402mm BGA, QFP & CSP 0.25mm HDMI Connectors / Micro USB Connectors | Chips 0402mm BGA, QFP & CSP 0.3mm Press Fit / High Pin Count Connectors |
| SMT Lines | 11 Lines, Samsung / JT | 9 Lines, Samsung / Panasonic / Sony | 5 Lines, Siemens / Samsung |
| SMT Capabilities | Monthly 788 Million Points | Monthly 298 Million Points | Monthly 63 Million Points |
| THT Lines | 3 Lines, Auto / Manual | 4 Lines, Auto / Manual | 2 Lines, Auto / Manual |
| Inspection Machines | SPI, AOI, 2D X-Ray | SPI, Optical Measuring (VMS-4030M), X-ray (SMX-1000) | SPI, AOI, X-ray, Microscope to 20X |
| Testing | ICT/Function test/Burn-in test/Aging Testing | ICT/Function test/Burn-in test | ICT/Function test/Burn-in test |
| Assembly Cost | Lower Costs | Lower Costs | Medium Cost |
| Lead Time | As fast as 9 days with shipping | As fast as 7 days with shipping | As fast as 3 days with shipping |
| Capabilities |
|---|---|
| Service Items | Shell design, customized processing, electromechanical system assembly |
| Material Types | Based on a rich database of material properties and practical application cases, accurately recommend shell materials for customers, including SPCC, stainless steel, aluminum alloy, titanium alloy, engineering plastics, medical plastics, etc. |
| Application Range | Security system shells, power supply shells, lamp shells, communication equipment shells, instrument shells, control equipment chassis, server chassis, consumer product shells, etc. |
| Processing Capabilities | Possess a variety of processes, including plastic/metal injection molding, die-casting, stamping, CNC, etc., and flexibly select the most suitable processing process according to different materials and design requirements. For complex plastic shells, the tolerance can be controlled within ±0.02mm; die-casting is used for large metal shells, and metal injection molding and stamping are used for more precise metal shell processing, with an efficiency of 50 - 100 pieces/minute. |
| Assembly Capabilities | Automatic and manual assembly, welding, ultrasonic welding, snap connection, glue bonding, drilling fixation, hot riveting, wire harness assembly, etc. |
| Quality Control | Implement the whole process quality control from raw material inspection to finished product inspection. Advanced testing equipment such as a spectral analyzer is used for raw material inspection to accurately analyze the chemical composition of materials and ensure that the quality of raw materials meets the requirements. During the processing process, the first article inspection, patrol inspection, and finished product inspection are carried out for each process, and the inspection standards are strictly implemented in accordance with international standards and customer requirements. |
| Quality Standards | ISO9001, NEMA, MIL - DTL - 38999 (cable assembly), AWS B2.1 (welding), MIL - C - 5541 (electroplating), MIL - STD - 595B (painting) |
| Testing Capabilities | Functionality, solder joint strength, optical testing, continuity, other professional testing requirements |
| Surface Treatments | Electroplating, powder spraying, painting, screen printing, customized colors, decals, etc. |
| Labeling and Serialization | Component level, circuit board level, wire/cable, chassis, shell |
| Shell Customization Guide | Before customizing the shell, in addition to the size, it is necessary to understand the specific usage environment and heat dissipation requirements, as well as the selection of related accessories. We have rich experience and can provide you with specific suggestions for free. Contact us now! |
Rigid PCB Production
| Rigid PCB Production | ||
|---|---|---|---|
| Materials | |||
| FR4 Regular | Shengyi, ITEQ, KB, Nanya | ||
| FR4 Mid. Tg | Shengyi S1000, ITEQ IT158, etc | ||
| FR4 High Tg | Shengyi S1000‐2,S1170, EMC EM827 ,Isola 370HR ,ITEQ IT180A, Panasonic R1755V.. | ||
| Metal Core | AL - high thermal conductivity (1W, 2W, 3W, 4W, 8W, 12W), Copper-based (DTP thermoelectric separation) | ||
| Production Capabilities | |||
| Specifications | Standard | Max. | |
| Max. Layer | 32 | 40 | |
| Max. PCB Size | 510*610mm | 620*720mm | |
| Min. Trace Width / Spacing | 0.08/0.08mm | 0.0635/0.0635mm | |
| Board Thickness | Min. | 0.40mm | 0.20mm |
| Max. | 3.20mm | 6.50mm | |
| Min. Hole Size | Mechanical Drilling | 0.20mm | 0.15mm |
| Laser Drilling | 0.10mm | 0.08mm | |
| Aspect Ratio | 25:1 | 35:1 | |
| Min. Basic Copper | 1/3oz [12µm] | 1/4oz [12µm] | |
| Max. Basic Copper | 10oz [350µm] | 33oz [1155µm] | |
| Core Thickness | 50um | 38um | |
| PP Thickness | 64um | 38um | |
| Min. Hole Pad | 0.46mm | 0.40mm | |
| Solder Mask | Registration | ± 50µm | ± 38µm |
| Min. Solder Mask Dam | 76um | 50um | |
| Outline Tolerance | ±0.10mm | ±0.05mm | |
| Surface Finish | Immersion gold, lead-free HASL, OSP, immersion tin, immersion silver, immersion nickel-palladium-gold, gold finger, electro-thin gold, full-board electro-hard gold, combined (e.g., HASL + electro-gold, OSP + immersion gold, etc.) | ||
| RF & High-Speed PCB |
|---|---|
| Materials | Rogers, Taconic, Arlon, Isola, F4B, Panasonic, Nelco, Wangling, Zhongying, Shengyi, etc |
| Production Capabilities | |
| Max. Layer | 24-layer |
| Max. Thickness | 6.0mm |
| Mixed Lamination | Rogers+FR4, PTFE+FR4, Rogers+Cu, PTFE+Cu, etc |
| Dielectric Constant (Dk) | 2.14~4 |
| Dissipation Factor (Df) | <0.002 |
| Coefficient of Thermal Expansion (CTE) | 0.1-1 |
| Microwave Band & Signal Rate | 0-128Ghz/128Gbs |
| High-speed Impedance Accuracy | ±8% (＞50Ω); ±5Ω (≤50Ω) |
| Surface Finish | Immersion Ag, Immersion Sn, Plating Au, Plating Ag, etc |
| Max. PCB Size | 510*620mm |
| Trace. Tolerance | +/-0.015mm |
| Min. Trace Width / Spacing | 0.08/0.08mm |
| Min. Hole Size | 0.08mm |
| PTH Treatment | Plasma, Ultrasonic Cleaning |
| Pre Treatment of SR | Sand Blast, Ultra Coarsening |
| Applications | Signal reception of communication base stations, radar, remote control, satellite positioning system, satellite signal reception, smart home, digital microwave system, etc. |
| Thick Copper PCB | ||||
|---|---|---|---|---|---|
| Production Capabilities | |||||
| Specifications | Standard | Max. | |||
| Max. Copper Thickness | 10oz [350µm] | 33oz [1155µm] | |||
| Max. PCB Size | 300*450mm | 510*620mm | |||
| Min. Trace Width / Spacing (2OZ) | 0.20mm / 0.18mm | 0.18mm / 0.16mm | |||
| Max. Board Thickness (2OZ) | 3.2mm | 6.0mm | |||
| Aspect Ratio | 8:1 | 10:1 | |||
| Min. Hole Copper Thickness | 25um | 50um | |||
| Max. Basic Copper Thickness | 10oz [350µm] | 33oz [1155µm] | |||
| Materials | High-stability Tg170 material, and PP with high Tg and high resin content | ||||
| Surface Finish | Usually immersion gold (ENIG) | ||||
| Layout Guide | |||||
 |  |
||||
| Cu Thickness | Min. Trace Width | Min. Trace Spacing | Min. Spacing from Pad to Trace | Min. Hole Dia. | Min. Hole Annularing |
| 2OZ | 0.20mm | 0.18mm | 0.16mm | 0.25mm | 0.18mm |
| 3OZ | 0.30mm | 0.20mm | 0.18mm | 0.3mm | 0.18mm |
| 4OZ | 0.35mm | 0.25mm | 0.23mm | 0.5mm | 0.25mm |
| 5OZ | 0.40mm | 0.30mm | 0.28mm | 0.6mm | 0.30mm |
| 6OZ | 0.45mm | 0.35mm | 0.33mm | 0.6mm | 0.35mm |
| 7OZ | 0.50mm | 0.40mm | 0.38mm | 0.8mm | 0.40mm |
| 8OZ | 0.55mm | 0.45mm | 0.43mm | 1.0mm | 0.45mm |
| 9OZ | 0.60mm | 0.50mm | 0.48mm | 1.0mm | 0.50mm |
| 10OZ | 0.65mm | 0.55mm | 0.53mm | 1.0mm | 0.55mm |
| 11-33OZ | Evaluation | Needs Process evaluation before production | |||
| FPC Production | |
|---|---|---|
| Material Brands | DuPont,Shengyi, ITEQ, Taiflex, Kingboard, Hongyu, TUC, Grace, Shintech, Yasen, etc | |
| Copper-Containing Materials | Rolled copper foil, Electroplated copper foil | |
| Production Capabilities | ||
| Max. Layer | 6-layer | |
| Board Thickness | 0.037-4mm | |
| Board Thickness Tolerance | +/-0.03mm | |
| Mixed Lamination | Rogers+FR4, PTFE+FR4, Rogers+Cu, PTFE+Cu, | |
| Surface Finished | OSP, HASL, Immersion Au, Immersion Ag,Gold plating, Silver plating | |
| Max. Size | 250*1000mm | |
| Min. Size | 8*12mm | |
| Min. Hole Size | 0.10mm | |
| Trace Tolerance | +/-0.015mm | |
| Min. Trace Width/Spacing | 0.05/0.05mm | |
| FPC Auxiliary Materials | Coverlay | |
| Stiffener | FR4, PI | |
| Steel sheet, Aluminum sheet, Copper sheet | ||
| Double-Sided Tape | 3M | |
| Others | Electromagnetic shielding film,Pure adhesive film,Pressure-sensitive adhesive,conductive adhesive film | |
| Items | Parameters |
|---|---|
| Material Brands | Shengyi, Doosan, Mitsubishi, etc |
| Min. Line Width/Spacing | 25μm/25μm |
| Min. Mechanical Hole Size/Pad | 100μm/150μm |
| Min. Pad Size | 50μm |
| Min. Pad Spacing | 40μm |
| Min. Solder Mask Bridge | 50μm |
| Solder Mask Opening Offset | ≤20μm |
| Layer-to-Layer Registration | ≤100μm |
| Finished Board Thickness | 0.1mm-5.0mm |
| Max. Fabrication Size | 530mm*620mm |
| Finger Center Spacing | 0.09mm |
| Ink Flatness | 极差5μm |
| Min. Line Width/Spacing | 35μm/35μm |
| Board Thickness Variation | ±5% |
| LED Pitch | P0.6mm |
| Quality Standards | IPC Classes 2/3 |
| Build Time | 5 Days - 5 Weeks |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
Questions & Answers
About PCBCool
1. What certifications does PCBCool hold?
We are ISO9001, ISO14001, and ISO13485 certified, and all products meet UL, RoHS, and REACH standards for global PCB manufacturing and PCB assembly services.
2. Where are your manufacturing sites?
PCBCool operates PCB and PCBA manufacturing in Shenzhen (PCBA, PCB, Box Building), Malaysia (PCBA), Mexico (PCBA), with sales/service offices in the US, Canada, Mexico, Germany, UK, Italy, Brazil, and Malaysia.
3. What services do you provide?
We offer Turnkey PCBA, PCB manufacturing, and ODM solutions from design to delivery, plus flexible standalone or combined services.
About PCB
4. What PCB materials and capabilities do you support?
Our PCB manufacturing supports FR-4, high-frequency laminates (Rogers, Taconic, Ventec, Wangling), rigid-flex, thick copper up to 33 oz, and copper-base up to 400 W/m·K.
5. What are your typical PCB lead times?
Prototype PCBs in 3–9 working days, expedited PCB manufacturing in 24–96 hours, and high-volume production in 10–20 days depending on complexity.
6. How do you ensure PCB quality?
All PCBs undergo AOI, flying probe, impedance (TDR), hi-pot, and cross-section testing, with IPC Class 2/3 capability for high-reliability applications.
About PCBA
7. What is your MOQ for PCBA?
We offer flexible PCB assembly services from 1-piece prototypes to high-volume PCBA.
8. How do you test and trace PCBA quality?
Our PCBA quality control includes SPI, AOI, X-ray, ICT/FCT, burn-in, and vibration testing, with full traceability via board-level barcodes and 3+ years of process data storage.
9. What are your typical PCBA lead times?
Prototype PCB assembly in 3–21 days, high-volume Turnkey PCBA in 14–28 days depending on materials and quantity.
10. Do you support NPI and DFM/DFA?
Yes — full NPI support, DFM/DFA reviews, FAI, and turnkey FCT fixtures/programs for faster, smoother PCBA production.
11. What after-sales support do you provide?
We offer 24-hour quality response for all PCB manufacturing and PCB assembly projects, SCAR handling, on-site support, and repair/remake/refund for quality issues.
