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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to [email protected] (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Fabrication · Assembly · Project review

PCB manufacturing & assembly capabilities

Compare fabrication and assembly routes, check the conditions behind published specifications, and prepare your project for an engineering review.

Plan your project ↓Request a capability review →
Six-layer conceptual PCB section: copper, dielectric and plated through-holeA complete construction, not an isolated limitSix-layer section · illustrative, not to scaleL1L2L3L4L5L6Platedthrough-holeCopperDielectricConfirm layer connections, thickness and copper together.
Conceptual cross-section, not to scale. A complete construction determines the manufacturing route.
Fabrication

Choose the construction

Rigid, HDI, flex, rigid-flex and specialist substrates. Check material and geometry together.

Compare fabrication routes →
Assembly

Define the supply boundary

SMT, through-hole and mixed assembly; turnkey, customer-supplied or mixed components.

Review assembly scope →
Verification

Agree what will be checked

Separate connectivity, impedance, joint inspection and product function in your order.

Review checks and evidence →

01 / Start with your project

Project Review Planner

Start with three choices. Add details only where useful, then get a brief covering your requirements, missing information and the next engineering decisions. No login or contact details required.

Add build quantity (optional)
Add fabrication details (optional)
Blank means unknown. Values describe your design; they do not establish a factory limit.
Assembly & test requirements

Your next engineering step

Three choices. A clearer next step.

You will receive a review path covering:

  • Your stated project requirements
  • Information still needed for review
  • Checks tailored to the scope and build stage

For an undecided design, choose “Not sure yet”. A completed stackup is not required to start a conversation.

Request a capability review →
Planning checklist, not a DFM approval or quotation. No project data is sent by this tool.

02 / Fabrication capabilities

Match the technology to the complete construction

Layer count, material, copper, thickness, hole geometry and tolerances interact. Select a route to see the information that determines manufacturability.

Published rigid-board references

1–24 layers · 3 / 3 mil line / space · ±10% impedance

Separate reference values from the rigid capability sheet, checked 5 November 2026. Material, copper, stackup and measurement conditions must be confirmed together. Read conditions and dimensional units ↓
Fabrication routes and review conditions
TechnologyDefine in the drawingCheck togetherDetailed guide
Rigid & multilayerLayer functions, finished thickness, inner/outer copper and controlled geometry.Stackup, drill definitions, material grade and impedance requirements.Multilayer design guide
HDIBuild-up structure, microvia spans, fill and stacked/staggered arrangement.Capture/target pads, dielectric depth, lamination sequence and reliability requirements.HDI construction guide
Flexible PCBStatic or dynamic use, bend area, copper and dielectric thickness.Bend radius, cycles, stiffeners, coverlay and connector interface.Flex design guide
Rigid-flexRigid/flex zones, layer transitions and assembly interfaces.Local thicknesses, bend geometry, stiffeners and mechanical drawing.Rigid-flex planning
RF / microwaveExact laminate grade, frequency range, foil and stackup.Transmission-line geometry, reference planes, tolerance and measurement method.RF fabrication guide
Ceramic substrateSubstrate system, metallization, isolation and attachment.Heat path, mechanical loads and joining process.Ceramic options
Heavy copper / metal coreCurrent, heat path, copper distribution and dielectric isolation.Define metal-base construction separately from copper weight.Heavy-copper guide
Rigid PCB published specifications: reference values and conditions

Selected values from our rigid PCB capability sheet, checked 5 November 2026. These are published reference values, not approval of their combination in your design.

Use the drawing and agreed stackup to confirm the order-specific limits.

ParameterPublished production referenceCondition to confirm
Rigid layer count1–24 layersHigher layer counts require a project-specific review; specify materials, thickness and via structure.
Minimum line / space0.0762 mm / 0.0762 mm (3 / 3 mil)Confirm copper thickness, layer and process combination. 3 mil converts to 0.0762 mm; do not round down in CAD rules.
Minimum board thickness2 layers: 0.3 mm
4 layers: 0.4 mm
6 layers: 0.8 mm		These are separate layer-count conditions, not a universal thickness range.
Controlled impedance±10% production referenceDefine nets, reference planes, target, coupons and the agreed measurement method.

Source: PCBSync rigid capability page. Published specifications require confirmation against the actual construction and quotation; this table does not certify a manufacturing process.

A minimum hole size and a maximum board thickness cannot be selected independently. Request the proposed stackup and an explicit list of exceptions against the released drawing.

03 / Design checks that change the route

Four relationships worth resolving before fabrication

COPPER & CLEARANCECheck etched geometry at the specified copper thickness.
Conceptual geometry, not to scale.

Copper thickness ↔ trace / space

Specify finished copper and identify inner and outer layers. An isolated fine-line number does not establish the same spacing at every copper weight. Ask which geometries need adjustment before routing is frozen.

HOLE & BOARD THICKNESSState drill diameter, finished hole and plating separately.
Hole definitions must be explicit in fabrication data.

Hole definition ↔ plated depth

A drill tool diameter is different from a finished plated-hole diameter. Confirm plating allowance, annular ring and the supplier’s aspect-ratio definition; a shallow microvia and a full-depth through-hole use different processes.

VIA SPAN & LAMINATIONDefine the connected layers; a via label is not a stackup.
Illustrative connections only; not a qualified HDI stackup.

Via spans ↔ build-up structure

State which copper layers each via connects, whether it is filled, and whether microvias are stacked or staggered. Package pitch alone does not determine the HDI construction. Review the actual pad map and escape routing.

PANEL & ASSEMBLY ACCESSLeave rails, tooling and component access in the plan.
Panel concept; rail dimensions depend on the process.

Panel geometry ↔ assembly access

Board size is not the same as usable panel area. Allow for rails, fiducials, tooling, test coupons and depanelization. Confirm component-to-edge clearances before committing to an array.

04 / PCB assembly capabilities

Define what arrives — and what leaves

PCBSync assembly services cover SMT, through-hole and mixed assembly, with turnkey, mixed or customer-supplied parts. Define the supply boundary before comparing quotations.

SMT & through-holeSingle / double-sided scopeTurnkey / consigned / mixed

Provide manufacturer part numbers, placement data and the assembly drawing. Flag sensitive parts, unusual heights, special soldering requirements and permitted substitutions.

Assembly planningTurnkey sourcing
SMT placement equipment and an operator on an assembly line
SMT assembly line from the PCBSync media library. Agree inspection coverage in the project scope.
Work packageDefine before releaseContinue planning
Components & placementBOM revision, approved alternates, customer kits, package data, assembly sides and board-edge clearances.BOM requirements
Programming & testFirmware version, programming interface, fixtures, procedure, pass/fail limits and record format.IC programming · Functional test
Coating & integrationMasking, coating requirements, cable drawings, enclosure interfaces and assembly sequence.Coating · Box build · Harnesses

05 / Inspection & evidence

Specify the result you need to verify

Agree the test coverage, sampling, acceptance criteria and report package for your order. Bare-board electrical testing, assembly inspection and product functional testing answer different questions.

Available on this page

See the process context

View assembly and test-fixture imagery, then watch the manufacturing overview. Use the comparison below to distinguish each type of check.

Watch the process overview →
Project-specific documents

Define the evidence package

Discuss a released stackup, inspection scope, test-record format and applicable quality documentation. Confirm which records can be supplied for your order.

Discuss records for my project →
ConcernRelevant checkRecord to agreeWhat it does not prove
Bare-board opens / shortsElectrical testNetlist reference, scope and test result.Product function, RF performance or all latent reliability risks.
Transmission-line impedanceAgreed impedance measurementTarget/tolerance, stackup, coupon and measurement report.All channel loss, crosstalk or assembled system behavior.
Visible assembly featuresAOI / visual inspectionInspection criteria, coverage and dispositions.All hidden joints or product functionality.
Hidden solder jointsX-ray inspectionSelected features, sampling and acceptance limits.Full electrical or functional verification.
Product behaviorFunctional testReleased procedure, fixtures, firmware and pass/fail results.Requirements outside the defined test coverage.

Review the evidence behind the scope

Confirm outgoing inspection records, electrical-test results, microsection scope and any functional testing required by your drawing or specification. State the applicable IPC requirements and agreed acceptance class.

Request current UL and ISO 9001 documentation, then check the legal entity, manufacturing site, validity and applicable scope. Identify additional customer or industry approvals before release.

Quality-control documentation →
Populated circuit board positioned in a test fixture
Board in a test fixture. The fixture photo illustrates a process; order-specific procedures and limits define actual test coverage.
Watch a PCB manufacturing process overview

Manufacturing process overview from the existing PCBSync video library. For your project, define the stackup and fabrication data first; agree inspection and release records with the order. This process overview does not replace capability approval or order-specific test evidence.

06 / See how a review becomes specific

Two example project discussions

Illustrative design reviews, not customer case studies or manufacturing approvals.

Example A · 6-layer FR-4 + BGA

Start with the escape routing

Known: 6 copper layers, 100 boards, controlled impedance and a BGA package.

Still needed: actual pad map, fanout, stackup, target nets, copper, BOM and test scope.

Review: compare the actual BGA pad map and routing channels before selecting through-holes or HDI.

Worked requirement: a 50 Ω target with ±10% tolerance gives a 45–55 Ω acceptance band. Agree the stackup, coupon and measurement method before release.

Decision output: record the chosen via spans and the agreed impedance requirement. The calculated band is not a measured result or proof of system performance.

Cost questions: lamination steps, via fill, panel utilization, sourcing and test fixtures.

Explore HDI design checks →
Example B · Rigid-flex enclosure

Define the flex motion first

Known: rigid sections connected by a flex region inside a compact enclosure.

Still needed: assembly drawing, bend location and radius, static/dynamic use, cycle requirements and flex-zone copper.

Decision: agree local construction and component keepouts with the mechanical design before finalizing tooling and assembly sequence.

Cost questions: materials, lamination, stiffeners, panelization and handling fixtures.

Explore rigid-flex planning →

07 / Prepare a capability review

Bring the files you have. Identify what is still open.

Fabrication package

  • Gerber or agreed CAD package and drill data
  • Fabrication drawing and proposed stackup
  • Material, copper, surface finish and controlled requirements
  • Board revision, quantities and target delivery date
Manufacturing scope and planning →

Assembly additions

  • BOM with manufacturer part numbers and substitution rules
  • Placement data and assembly drawing
  • PCB/component supply responsibility
  • Programming, coating, test procedure and fixture needs
Stencil requirements →

Before production, approve the construction, deviations, sourcing changes, inspection criteria and commercial scope. Confirm the conditions that start the lead time. If an NDA or special file-transfer arrangement is needed, discuss it before sending files.

Ready to discuss your construction?

Use your review checklist to explain the design, open questions and records you need. Submit your inquiry on our Contact page.

Contact PCBSync →

Practical answers

PCB capability review FAQ

Can all listed capability limits be combined in one PCB?

No. Copper, feature geometry, material, board thickness, hole spans and process sequence interact. Confirm a complete construction and its tolerances before releasing production files.

Can I request a review before my stackup is finalized?

Yes. Provide the intended layer functions, material requirements, mechanical limits and any controlled impedance. Clearly identify open assumptions so the proposed stackup can be reviewed before layout is frozen.

How do fabrication and assembly capabilities differ?

Fabrication defines the bare board. Assembly adds component sourcing or kit handling, placement, soldering and any agreed programming or testing. Include both sets of requirements when ordering a turnkey build.

Which test records should I request?

Start with the risks and acceptance requirements of your product. Specify bare-board connectivity, impedance, visual or hidden-joint inspection, and functional testing separately. Agree sampling, limits and record formats rather than assuming every test is included.

What changes PCB manufacturing cost?

Material, copper, layer construction, lamination cycles, hole processes, tolerances, panel utilization, quantity and inspection all influence fabrication. Assembly also depends on sourcing, placement, special processing, fixtures and test time. The finder identifies review items; it does not generate a binding price.

Where do I submit my files or inquiry?

Go to Contact PCBSync. Include your project subject, revision, quantities and the questions you need answered. If you used the finder, copy its brief into your message.