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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to [email protected] (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

PCB manufacturing / HDI PCB / HDI PCB capabilities
PCBSync · HDI engineering & manufacturing

HDI PCB capabilities: define the complete construction

Review the combination that matters: microvia depth and diameter, fine-line routing, build-up sequence, material and acceptance evidence. Submit a capability enquiry tied to an actual stack-up.

Open project toolsRequest engineering quote

Construction, material availability, price and schedule confirmed after file review.

Green bare-board sample with fine-pitch pad fields and mounting holes. Internal via structure must be verified through project records.
Green bare-board sample with fine-pitch pad fields and mounting holes. Internal via structure must be verified through project records.

Key distinction: A supplier’s smallest hole, thinnest dielectric and finest trace cannot be assumed achievable together. Combined-construction review is essential.

Explore the design before release

HDI PCB capabilities tools & quotation planning

HDI PCB capabilities project tools

PCBSync Engineering Tools · calculations run in your browser · no account required

Geometry only. State whether your diameter means laser opening or finished hole. Compare with the fabricator’s rule for the same definition. No universal pass/fail threshold is applied.

Start with your design inputs

Example numbers are editable. Review the result and its assumptions before adding it to your enquiry.

Design tips and manufacturing decisions

HDI PCB capabilities: what to resolve before fabrication

Use a construction envelope, not a collection of minima

Prepare a table for each via family: start layer, stop layer, process, diameter, land, fill and cap. Add finished copper and the dielectric thickness crossed. The first question is whether those features are compatible in the same panel and process sequence.

Previously published generic geometry values are not a released capability commitment. Ask PCBSync to identify standard, advanced-review and unsupported requirements against the submitted revision. A written exception list is more useful than selecting the smallest number from several unrelated examples.

Separate electrical intent from physical production dimensions

For PCB impedance control, supply target impedance and tolerance, signal reference layers and critical differential pairs. The fabricator needs resin content, glass style, copper foil and pressed dielectric thickness to propose manufacturable trace dimensions. A nominal laminate Dk by itself does not complete the stack-up.

Identify features that cannot be changed without design approval. If the process team proposes larger lands or different via staggering, the layout team should review BGA escape and return paths before accepting the change.

Agree the evidence before starting the lot

Request the specific records required for your product: material identification, stack-up confirmation, netlist test, dimensional checks, impedance evidence or microsections. Additional reflow or reliability qualification is a separately defined scope.

Provide the acceptance standard, contractual revision and any customer-specific exceptions. A generic IPC class label does not describe every microvia reliability test. The tool captures these requirements; it cannot inspect Gerbers or approve a production process.

Published reference values

Use these figures to start the capability discussion

FeatureExisting PCBSync referenceWhat still needs review
Laser drilling0.10 mm standard reference; 0.075 mm advanced reviewConfirm dielectric depth, land and fill together
Mechanical drilling0.15 mm published minimum referenceConfirm plated-hole definition and subassembly depth
Trace / gap0.075 / 0.075 mm published referenceConfirm finished copper, etch and registration allowances
Finished copper18–70 µm published rangeIdentify inner and outer copper separately
Board thickness0.40–6.50 mm published rangeConfirm the exact material and build-up sequence
Panel / board sizeUp to 610 × 450 mm in the published tableLaser equipment, tooling and usable panel area require review

Source: the existing PCBSync HDI capability component, reviewed 1 October 2026. These published references have not been independently requalified in this website update. They are not simultaneous limits or a commitment for an unreviewed construction. Request confirmation against your actual stack-up.

A clearer brief gets a clearer response

Four requirements for this enquiry

01

Proposed stack-up and finished thickness

02

Microvia depth / diameter / land geometry

03

Trace, spacing, copper and via fill

04

Inspection class, revision and test deliverables

Attach the current fabrication files and drawing revision. Mark open questions, permitted alternatives and requested delivery timing. For assembly, add BOM and placement files. Ask for exceptions and additional test costs to be identified in the response.

Real physical circuits

Board details that the manufacturing review must connect

These physical PCB photographs come from the PCBSync media library. They illustrate visible pads, board outlines and panel details; they do not verify a particular hidden via structure, material grade, layer count or application qualification.

Physical circuit-board example with dense pads and a central opening. The photograph does not identify a verified laminate grade.
Physical circuit-board example with dense pads and a central opening. The photograph does not identify a verified laminate grade.
Panelized PCB example with repeated board outlines. Panelization, tooling and separation belong in the manufacturing review.
Panelized PCB example with repeated board outlines. Panelization, tooling and separation belong in the manufacturing review.
Answers for design and procurement

HDI PCB capabilities FAQ

What should I resolve first for HDI PCB capabilities?

A supplier’s smallest hole, thinnest dielectric and finest trace cannot be assumed achievable together. Combined-construction review is essential.

Can this tool approve my design or provide a final price?

No. Geometry and allocation outputs are planning aids based on your inputs. The checklist records information prepared for review. Where a budget tab is available, its uncalibrated figures are references, not order prices. Feasibility, material, verification scope, price and schedule require review of the actual construction.

What should I include in an HDI quotation request?

Send the current artwork and drills, outline, stack-up, via spans, quantity and requested timing. Add the material, impedance and acceptance requirements. For an assembled board, include BOM and placement data. Identify open decisions and permitted alternatives.

Technical references: JLCPCB: construction-specific HDI capability FAQ ↗ IPC: IPC-6012F scope and qualification update ↗ Würth Elektronik: HDI design guide ↗

References checked 1 October 2026. Historical sources are labeled. Manufacturer examples are not PCBSync capability commitments; use current, construction-specific data for design release.

From requirements to a reviewable quotation

Discuss your HDI PCB capabilities project

Send the construction you want reviewed

If useful, add a planning result and your assumptions to the enquiry. Include the board revision, quantity, requested arrival date and open questions. Ask the quotation to identify the proposed stack-up, exceptions and inspection scope.

Need an NDA or a particular file-transfer arrangement? Contact us before sending files.

Email: [email protected]
Phone: +86-755-23203480

Review your message and attachments before submitting. An enquiry does not place an order.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.