PCB X-Ray Inspection for Hidden Solder Joints

Identify the target component, package and joint or region of interest. A request to examine bridging, projected voiding or alignment needs a defined image basis and interpretation. Include assembly drawings and component-side information so the inspector can relate the view to the correct physical location. For a BGA assembly request, identify the package and ball locations that need review.

State whether the work is production inspection, first-article review or investigation of a reported failure. These purposes can require different coverage, image detail and reporting. Ask PCBSync to review the target list rather than assume that every feature on a dense double-sided board can be resolved by one view.

A two-dimensional projection superimposes structures along the beam path. Oblique views may help separate features, while appropriate tomographic or laminographic methods can provide different depth information. The available equipment and setup must be assessed against the target; a generic "3D" label does not define the result.

Confirm the proposed method and limitations before ordering. Do not assume PCBSync offers a particular CT capability, resolution or analysis format based only on a photograph. If the needed observation is not supported, identify a suitable alternative or escalation before treating an image as proof of conformity.

Label each image with product identity, revision, reference designator and view information. For an area measurement, define the region boundary, image scale and segmentation method. A projected void percentage is not automatically a three-dimensional void volume or a universal accept/reject threshold.

Use the workbench to summarize entered projected areas while retaining each individual region result. It does not inspect an uploaded image. Request the applicable package or project criteria and have ambiguous indications reviewed. A pooled value must not conceal an unacceptable condition at one critical joint.

The report should distinguish observations, interpretations, unresolved questions and disposition. Electrical checks and functional tests may be needed to connect an image indication with the reported behavior. A normal-looking view cannot establish every metallurgical, electrical or lifetime property of the assembly.

For a quotation, send the target list, quantity, requested coverage and report requirements with the PCB assembly scope. Separate acquisition, review, special analysis and any reinspection after repair. Agree who authorizes further work and what evidence is required before the affected assemblies are released or returned to the next process stage.